Coating equipment, mainly refers to a kind of coating that needs to be carried out in high vacuum, including many kinds, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and so on. The main idea is divided into evaporation and sputtering.
In the magnetron sputtering system, 100-1000 Gauss strong magnets are placed behind the cathode target, and inert gas (AR) with pressure of 011-10pa is charged into the vacuum chamber as the carrier of gas discharge. Under the action of high pressure, Ar atoms ionize into Ar + ions and electrons. In the process of accelerating to the substrate, the electrons are affected by the magnetic field perpendicular to the electric field, which makes the electrons deflect and bound in the plasma region near the target surface. The electrons advance along the target surface in a cycloidal way, and constantly collide with Ar atoms in the process of movement, ionizing a large number of Ar + ions.


After many collisions, the energy of electrons gradually decreases, and finally falls on the substrate, the wall of the vacuum chamber and the anode of the target source. Under the acceleration of high-voltage electric field, Ar + ions collide with the target and release energy, which causes the atoms on the surface of the target to absorb the kinetic energy of Ar + ions and break away from the original lattice. The neutral target atoms escape from the surface of the target and fly to the substrate, and form films on the substrate.